PLIOBOND 20 Contact Adhesive
PLIOBOND 20 Contact Adhesive is a general-purpose thermosetting adhesive that can be used to bond virtually all porous and nonporous substrates. When cured, PLIOBOND 20 adhesive provides tough, chip resistant bonds that remain flexible over a wide temperature range. Substrates bonded with PLIOBOND 20 adhesive offer excellent resistance to mechanical shock and oxidization. This adhesive provides outstanding dielectric properties and has low water absorption. Thin with MEK. Ships ground freight only.
|PBC20||PLIOBOND 20 Contact Adhesive, 1/2 Pt|